Ceramic PCB

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Capability-Ceramic PCB

 

No.

Items

Capability

1

Laminates

Alumina(AL2O3)

Aluminum Nitride(AIN)

2

Layers

1-2

3

Max Size

170mm X 240mm

4

Min.Board Thickness

0.2mm

5

Max.Board Thickness

2.0mm

6

Finished Copper

1oz - 10oz

7

Min.Line/Space

Thin film copper plating   process:0.075mm

Thick film printing process:0.15mm

8

Min.Finished Hole

0.07mm±0.02mm

9

Circuit accuracy

Thin film copper plating   process:±1%

Thick film printing process:±10%

10

Bonding force   between metal and ceramic

Thin film copper   plating process:5N/CM2

Thick film printing   process:1-2N/CM2

11

Surface   Roughness

Thin film copper plating   process:0.3 um

Thick film printing process:3 um

12

Hole Surface Roughness

0.3um

13

Thermal Conductivity

Alumina(AL2O3)22   W/mK

Aluminum Nitride(AIN)170   W/mK

14

Coefficient of Thermal   Expansion (CTE)

Alumina(AL2O3)5.95 ppm/°C

Aluminum   Nitride(AIN)3.16 ppm/°C

15

Withstand temperature

Thin film copper plating   process:300

Thick film printing process:400

16

Solder resistance

Ink coating

17

Resistivity

1.59x10^-8Ω.m

18

Surface finish

Immersion   Nickel/Gold/Silver/ Palladium, OSP

19

Surface Finish   Thickness

0.03 um—10 um