Capability-Ceramic PCB
No. | Items | Capability |
1 | Laminates | Alumina(AL2O3) Aluminum Nitride(AIN) |
2 | Layers | 1-2 |
3 | Max Size | 170mm X 240mm |
4 | Min.Board Thickness | 0.2mm |
5 | Max.Board Thickness | 2.0mm |
6 | Finished Copper | 1oz - 10oz |
7 | Min.Line/Space | Thin film copper plating process:0.075mm Thick film printing process:0.15mm |
8 | Min.Finished Hole | 0.07mm±0.02mm |
9 | Circuit accuracy | Thin film copper plating process:±1% Thick film printing process:±10% |
10 | Bonding force between metal and ceramic | Thin film copper plating process:5N/CM2 Thick film printing process:1-2N/CM2 |
11 | Surface Roughness | Thin film copper plating process:0.3 um Thick film printing process:3 um |
12 | Hole Surface Roughness | 0.3um |
13 | Thermal Conductivity | Alumina(AL2O3):22 W/m‧K Aluminum Nitride(AIN):170 W/m‧K |
14 | Coefficient of Thermal Expansion (CTE) | Alumina(AL2O3):5.95 ppm/°C Aluminum Nitride(AIN):3.16 ppm/°C |
15 | Withstand temperature | Thin film copper plating process:300℃ Thick film printing process:400℃ |
16 | Solder resistance | Ink coating |
17 | Resistivity | 1.59x10^-8Ω.m |
18 | Surface finish | Immersion Nickel/Gold/Silver/ Palladium, OSP |
19 | Surface Finish Thickness | 0.03 um—10 um |
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